Thermaltake TG 30 Thermal Compound 4g
In stock
Mobitel Price | Retail Price
$10.26
In stock
Designed to lower CPU temperatures effectively, TG-30 is a premium thermal compound which contains diamond powder to improve thermal conductivity to maximize heat transfer, providing a longer lifespan eliminating dry-out or cracking while in use. This thermal compound application kit includes a set of easily-applied tools for immediate use. On top of that, the TG-30 s honeycomb stencil can help users to apply thermal compound for a neat and well-covered surface which fits all CPUs
| Weight | 1.00 kg |
|---|---|
| Brand | Thermaltake |
| Mpn | CL-O023-GROSGM-A |
| Prop 65 warning | -, and, Cancer, Harm, Reproductive, WARNING:, www.P65Warnings.ca.gov. |
| Upc | 841163075845 |
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